IBOX-007

The IBOX-007 fanless system is an ideal, application-ready, system platform solution with rich expandsion slots. All electronic components are protected in a compact, sealed chassis that is easy to embed in a customer’s own enclosure or use as a stand-alone unit when space is limited.
  • Workstation-grade Platform : 12th-14th Gen Intel® Core™ i7/i5/i3 Processor (Alder Lake/Raptor Lake) running with Intel® Q670 chipset
  • DDR4 Memory supports up to 3200MHz
  • Expansion : 2 M.2 2280 Key M or 1 M.2 Key M+1 M.2 KeyB, 1 Mini PCIe
  • Multiple 5G/WiFi 6/4G/LTE/GPRS/UMTS
  • Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
  • DC 9V to 36V Power Input, Optional Software Ignition Control
  • Support easily Swappable HDD Design, max 4* 2.5 inch SSD
  • Fully enclosed aluminum alloy anti-interference structure with fanlesscooling system
  • Modular parts and cable-free design with strong scalability for bettervibration resistance

Featuring workstation-grade platform: powered by 12th Generation Intel® Core™ i9/i7/i5/i3 processor (Alder Lake/Raptor Lake) and running with Q670 chipset, TP-IPC IBOX-007 delivers high-performance computing capability. The system is equipped with 2 PCIe, 2 M.2, 1 Mini PCIe. IBOX-007 supports 2 DDR4 memory up to 64GB and features max. 2 independent displays with 8K resolution. The brand new IBOX-007 offers a variety of connectivity and supports 9V to 36V DC-in to meet industrial requirements and is ideally suited for High-Speed AOI, 3D Mapping, Rolling Stock and any AIoT/Industry 4.0 applications.

Model

IBOX-007

Supported OS

Win 10, Win11, Linux (Ubantu, Dibian, Kali, CentOS, etc.); Win 10 IoT

Chipset

Model

Intel® Q670 Chipset, Intel® Alder Lake-S, TDP 6W

CPU

Socket

Intel® Desktop Processors Socket LGA1700

Series & TDP

12th Gen. Intel® Core™ i3 processor, Max. 65W TDPs

12th Gen. Intel® Core™ i9/ i7/ i5 processor, Max. 35W TDPs

Graphic

Intel® UHD Graphics 730, 24 Execution Units

Intel® HD Graphics 770, 32 Execution Units

vPRO Tech

Non-Supported

Supported

RAM

SO-DIMM

2* Dual-CH DDR4 3200 MHz SO-DIMM Socket, Capacity up to 64GB

Storage Device

M.2

1* M.2 2242/2280 PCIe x4 NVMe SSD (M-key, 2280/2242, From CPU)

1* M.2 3052/2280 PCIe x4/SATA/USB3.0/USB2.0 (M-key, Default PCIe x4, Support PCIe x4 NVMe SSD, 3052/2280, From PCH)

SATA

4 * SATA3.0 7P Port, support max 4* swappable SSD design, support RAID 0/1/5/10

I/O Interface

COM

2* COM DB9/M (COM1/2, RS232/RS485/RS422, sel by BIOS); 2* RS232 Header (COM3/4, expanded by I/O Daughter Card)

Ethernet

1* Intel® I219 GBE Ethernet Controller, LAN5, RJ45

1* Intel® I210 GBE Ethernet Controller, LAN6, RJ45

8* Intel® I210 GBE Ethernet Controller, RJ45, LAN1-4, LAN7-10, support PoE (LAN7-LAN10 are expanded by I/O Daughter Card)

USB

4* USB3.0; 4* USB2.0; 1* Internal USB2.0; 2* USB3.0 (These two USB3.0 are expanded by I/O Daughter Card)

Video

2 * HDMI (TYPE-A), Support 3840*2160@60Hz;

Audio

1 * Line-Out + MIC 2in1 Jack; 1 * Front Audio Header (Line-out + MIC)

SIM

1* Internal SIM card slot connected to Mini-PCIe

Power Supply

9-36V DC; 1* Terminal Block (4-Pin, 5.08mm)

Other

1* 8-bit GPIO header (4-Inputs/4-Outputs, 0-5V Input Range, on motherboard);

1* 16-bit GPIO on Terminal Block (8-Inputs/8-Outputs, 5-48V Input Range, 10*2Pin, 2.54mm, Expanded by I/O Daughter Card)

1* Remote Switch on Terminal Block (2*1Pin, 3.5mm, Expanded by I/O Daughter Card)

Extended

Capabilities

Additional

Internal Interface

1* Mini-PCIe with SIM Card Slot (PCIe+USB2.0, support WiFi or 4G)

Environment

Operating Temperature

-20 ~ 55 °C w/ 0.7m/s Airflow

Relative Humidity

40 °C @ 95%, Non-Condensing

Physical

Characteristics

Dimensions

290.35* 79.6* 234 mm (W* H* D)

Net Weight

7 KG

Regulation

EMC

CE/FCC Class B, CCC

Safety

CE-LVD, RoHS, CCC

CPU

Code Name

Total Cores

Total Threads

Max Turbo Frequency

Base Frequency

Cache

TDP

MemoryTypes

Integrated Graphics

Intel® Core™ I3-12100T

Alder Lake

4

8

4.10 GHz

2.20 GHz

12 MB Intel® Smart Cache

35 W

DDR4

Intel® HD Graphics 730, 24EUs

Intel® Core™ I5-12500T

Alder Lake

6

12

4.40 GHz

2.00 GHz

18 MB Intel® Smart Cache

35 W

DDR4

Intel® HD Graphics 770, 32EUs

Intel® Core™ I7-12700T

Alder Lake

12

20

4.70 GHz

1.40 GHz

25 MB Intel® Smart Cache

35 W

DDR4

Intel® HD Graphics 770, 32EUs

Intel® Core™ I9-12900T

Alder Lake

16

24

4.90 GHz

1.40 GHz

30 MB Intel® Smart Cache

35 W

DDR4

Intel® HD Graphics 770, 32EUs

Intel® Core™ I3-12100

Alder Lake

4

8

4.30 GHz

3.30 GHz

12 MB Intel® Smart Cache

65 W

DDR4

Intel® HD Graphics 730, 24EUs

Optional items Max Qty Description
I/O Daughter Card 1 Connected by IO expand slot, offering 4* PoE LAN+1* 16bit GPIO( 5-48V)+1* Remote Switch+ 2* USB3.0
4G/5G Module 1 Connected by Mini-PCIe or M.2 interface
WiFi Module without AP mode 1 Connected by Mini-PCIe interface
WiFi Module with AP mode 1 Connected by Mini-PCIe interface
Dual channel CAN-Bus Module 2 Connected by Mini-PCIe or M.2 interface
Dual GbE PoE LAN Module 3 Connected by Mini-PCIe or M.2 interface
AI Acceleration Card 4 26 TOPS, Connected by M.2 interface; 13 TOPS, Connected by Mini-PCIe interface
Ignition Switch Module 1 Phoenix Terminal connector, connected by internal power switch and 4-pin ATX power connector
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